Foundries are the primary end-user of the semiconductor fabrication market due to the steady adoption of fabless business model. The market will witness increasing demand for devices such as memory, logic, discrete, analog, sensor, and opto devices. Subsequently, the vendors must ensure and enhance their equipment quality to cater to the growing demand.
APAC will be the major revenue contributor to the semiconductor fabrication market owing to the large number of semiconductor foundries located in China, Taiwan, South Korea, and Japan. The construction of fabs and steady adoption of fabless business model will further supplement the growth of the semiconductor wafer grinding equipment market in APAC.
The global Semiconductor Wafer Grinding Equipments market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Wafer Grinding Equipments volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Wafer Grinding Equipments market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Semiconductor Wafer Grinding Equipments in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Semiconductor Wafer Grinding Equipments manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Applied Materials
Ebara Corporation
Lapmaster
Logitech
Entrepix
Revasum
Tokyo Seimitsu
Logomatic
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Cylindrical Grinding
Surface Grinding
Other
Segment by Application
Foundries
Memory Manufacturers
IDMs
APAC will be the major revenue contributor to the semiconductor fabrication market owing to the large number of semiconductor foundries located in China, Taiwan, South Korea, and Japan. The construction of fabs and steady adoption of fabless business model will further supplement the growth of the semiconductor wafer grinding equipment market in APAC.
The global Semiconductor Wafer Grinding Equipments market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Wafer Grinding Equipments volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Wafer Grinding Equipments market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Semiconductor Wafer Grinding Equipments in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Semiconductor Wafer Grinding Equipments manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Applied Materials
Ebara Corporation
Lapmaster
Logitech
Entrepix
Revasum
Tokyo Seimitsu
Logomatic
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Cylindrical Grinding
Surface Grinding
Other
Segment by Application
Foundries
Memory Manufacturers
IDMs
Table of Contents
Executive Summary
1 Industry Overview of Semiconductor Wafer Grinding Equipments
1.1 Definition of Semiconductor Wafer Grinding Equipments
1.2 Semiconductor Wafer Grinding Equipments Segment by Type
1.2.1 Global Semiconductor Wafer Grinding Equipments Production Growth Rate Comparison by Types (2014-2025)
1.2.2 Cylindrical Grinding
1.2.3 Surface Grinding
1.2.4 Other
1.3 Semiconductor Wafer Grinding Equipments Segment by Applications
1.3.1 Global Semiconductor Wafer Grinding Equipments Consumption Comparison by Applications (2014-2025)
1.3.2 Foundries
1.3.3 Memory Manufacturers
1.3.4 IDMs
1.4 Global Semiconductor Wafer Grinding Equipments Overall Market
1.4.1 Global Semiconductor Wafer Grinding Equipments Revenue (2014-2025)
1.4.2 Global Semiconductor Wafer Grinding Equipments Production (2014-2025)
1.4.3 North America Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.4 Europe Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.5 China Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.6 Japan Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.7 Southeast Asia Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.8 India Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Semiconductor Wafer Grinding Equipments
2.3 Manufacturing Process Analysis of Semiconductor Wafer Grinding Equipments
2.4 Industry Chain Structure of Semiconductor Wafer Grinding Equipments
3 Development and Manufacturing Plants Analysis of Semiconductor Wafer Grinding Equipments
3.1 Capacity and Commercial Production Date
3.2 Global Semiconductor Wafer Grinding Equipments Manufacturing Plants Distribution
3.3 Major Manufacturers Technology Source and Market Position of Semiconductor Wafer Grinding Equipments
3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
4.1 Semiconductor Wafer Grinding Equipments Production and Capacity Analysis
4.2 Semiconductor Wafer Grinding Equipments Revenue Analysis
4.3 Semiconductor Wafer Grinding Equipments Price Analysis
4.4 Market Concentration Degree
5 Semiconductor Wafer Grinding Equipments Regional Market Analysis
5.1 Semiconductor Wafer Grinding Equipments Production by Regions
5.1.1 Global Semiconductor Wafer Grinding Equipments Production by Regions
5.1.2 Global Semiconductor Wafer Grinding Equipments Revenue by Regions
5.2 Semiconductor Wafer Grinding Equipments Consumption by Regions
5.3 North America Semiconductor Wafer Grinding Equipments Market Analysis
5.3.1 North America Semiconductor Wafer Grinding Equipments Production
5.3.2 North America Semiconductor Wafer Grinding Equipments Revenue
5.3.3 Key Manufacturers in North America
5.3.4 North America Semiconductor Wafer Grinding Equipments Import and Export
5.4 Europe Semiconductor Wafer Grinding Equipments Market Analysis
5.4.1 Europe Semiconductor Wafer Grinding Equipments Production
5.4.2 Europe Semiconductor Wafer Grinding Equipments Revenue
5.4.3 Key Manufacturers in Europe
5.4.4 Europe Semiconductor Wafer Grinding Equipments Import and Export
5.5 China Semiconductor Wafer Grinding Equipments Market Analysis
5.5.1 China Semiconductor Wafer Grinding Equipments Production
5.5.2 China Semiconductor Wafer Grinding Equipments Revenue
5.5.3 Key Manufacturers in China
5.5.4 China Semiconductor Wafer Grinding Equipments Import and Export
5.6 Japan Semiconductor Wafer Grinding Equipments Market Analysis
5.6.1 Japan Semiconductor Wafer Grinding Equipments Production
5.6.2 Japan Semiconductor Wafer Grinding Equipments Revenue
5.6.3 Key Manufacturers in Japan
5.6.4 Japan Semiconductor Wafer Grinding Equipments Import and Export
5.7 Southeast Asia Semiconductor Wafer Grinding Equipments Market Analysis
5.7.1 Southeast Asia Semiconductor Wafer Grinding Equipments Production
5.7.2 Southeast Asia Semiconductor Wafer Grinding Equipments Revenue
5.7.3 Key Manufacturers in Southeast Asia
5.7.4 Southeast Asia Semiconductor Wafer Grinding Equipments Import and Export
5.8 India Semiconductor Wafer Grinding Equipments Market Analysis
5.8.1 India Semiconductor Wafer Grinding Equipments Production
5.8.2 India Semiconductor Wafer Grinding Equipments Revenue
5.8.3 Key Manufacturers in India
5.8.4 India Semiconductor Wafer Grinding Equipments Import and Export
6 Semiconductor Wafer Grinding Equipments Segment Market Analysis (by Type)
6.1 Global Semiconductor Wafer Grinding Equipments Production by Type
6.2 Global Semiconductor Wafer Grinding Equipments Revenue by Type
6.3 Semiconductor Wafer Grinding Equipments Price by Type
7 Semiconductor Wafer Grinding Equipments Segment Market Analysis (by Application)
7.1 Global Semiconductor Wafer Grinding Equipments Consumption by Application
7.2 Global Semiconductor Wafer Grinding Equipments Consumption Market Share by Application (2014-2019)
8 Semiconductor Wafer Grinding Equipments Major Manufacturers Analysis
8.1 Applied Materials
8.1.1 Applied Materials Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.1.2 Applied Materials Product Introduction, Application and Specification
8.1.3 Applied Materials Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.1.4 Main Business and Markets Served
8.2 Ebara Corporation
8.2.1 Ebara Corporation Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.2.2 Ebara Corporation Product Introduction, Application and Specification
8.2.3 Ebara Corporation Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.2.4 Main Business and Markets Served
8.3 Lapmaster
8.3.1 Lapmaster Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.3.2 Lapmaster Product Introduction, Application and Specification
8.3.3 Lapmaster Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.3.4 Main Business and Markets Served
8.4 Logitech
8.4.1 Logitech Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.4.2 Logitech Product Introduction, Application and Specification
8.4.3 Logitech Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.4.4 Main Business and Markets Served
8.5 Entrepix
8.5.1 Entrepix Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.5.2 Entrepix Product Introduction, Application and Specification
8.5.3 Entrepix Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.5.4 Main Business and Markets Served
8.6 Revasum
8.6.1 Revasum Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.6.2 Revasum Product Introduction, Application and Specification
8.6.3 Revasum Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.6.4 Main Business and Markets Served
8.7 Tokyo Seimitsu
8.7.1 Tokyo Seimitsu Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.7.2 Tokyo Seimitsu Product Introduction, Application and Specification
8.7.3 Tokyo Seimitsu Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.7.4 Main Business and Markets Served
8.8 Logomatic
8.8.1 Logomatic Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.8.2 Logomatic Product Introduction, Application and Specification
8.8.3 Logomatic Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.8.4 Main Business and Markets Served
9 Development Trend of Analysis of Semiconductor Wafer Grinding Equipments Market
9.1 Global Semiconductor Wafer Grinding Equipments Market Trend Analysis
9.1.1 Global Semiconductor Wafer Grinding Equipments Market Size (Volume and Value) Forecast 2019-2025
9.2 Semiconductor Wafer Grinding Equipments Regional Market Trend
9.2.1 North America Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.2 Europe Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.3 China Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.4 Japan Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.5 Southeast Asia Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.6 India Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.3 Semiconductor Wafer Grinding Equipments Market Trend (Product Type)
9.4 Semiconductor Wafer Grinding Equipments Market Trend (Application)
10.1 Marketing Channel
10.1.1 Direct Marketing
10.1.2 Indirect Marketing
10.3 Semiconductor Wafer Grinding Equipments Customers
11 Market Dynamics
11.1 Market Trends
11.2 Opportunities
11.3 Market Drivers
11.4 Challenges
11.5 Influence Factors
12 Conclusion
13 Appendix
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Author List
13.4 Disclaimer
Executive Summary
1 Industry Overview of Semiconductor Wafer Grinding Equipments
1.1 Definition of Semiconductor Wafer Grinding Equipments
1.2 Semiconductor Wafer Grinding Equipments Segment by Type
1.2.1 Global Semiconductor Wafer Grinding Equipments Production Growth Rate Comparison by Types (2014-2025)
1.2.2 Cylindrical Grinding
1.2.3 Surface Grinding
1.2.4 Other
1.3 Semiconductor Wafer Grinding Equipments Segment by Applications
1.3.1 Global Semiconductor Wafer Grinding Equipments Consumption Comparison by Applications (2014-2025)
1.3.2 Foundries
1.3.3 Memory Manufacturers
1.3.4 IDMs
1.4 Global Semiconductor Wafer Grinding Equipments Overall Market
1.4.1 Global Semiconductor Wafer Grinding Equipments Revenue (2014-2025)
1.4.2 Global Semiconductor Wafer Grinding Equipments Production (2014-2025)
1.4.3 North America Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.4 Europe Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.5 China Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.6 Japan Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.7 Southeast Asia Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
1.4.8 India Semiconductor Wafer Grinding Equipments Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Semiconductor Wafer Grinding Equipments
2.3 Manufacturing Process Analysis of Semiconductor Wafer Grinding Equipments
2.4 Industry Chain Structure of Semiconductor Wafer Grinding Equipments
3 Development and Manufacturing Plants Analysis of Semiconductor Wafer Grinding Equipments
3.1 Capacity and Commercial Production Date
3.2 Global Semiconductor Wafer Grinding Equipments Manufacturing Plants Distribution
3.3 Major Manufacturers Technology Source and Market Position of Semiconductor Wafer Grinding Equipments
3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
4.1 Semiconductor Wafer Grinding Equipments Production and Capacity Analysis
4.2 Semiconductor Wafer Grinding Equipments Revenue Analysis
4.3 Semiconductor Wafer Grinding Equipments Price Analysis
4.4 Market Concentration Degree
5 Semiconductor Wafer Grinding Equipments Regional Market Analysis
5.1 Semiconductor Wafer Grinding Equipments Production by Regions
5.1.1 Global Semiconductor Wafer Grinding Equipments Production by Regions
5.1.2 Global Semiconductor Wafer Grinding Equipments Revenue by Regions
5.2 Semiconductor Wafer Grinding Equipments Consumption by Regions
5.3 North America Semiconductor Wafer Grinding Equipments Market Analysis
5.3.1 North America Semiconductor Wafer Grinding Equipments Production
5.3.2 North America Semiconductor Wafer Grinding Equipments Revenue
5.3.3 Key Manufacturers in North America
5.3.4 North America Semiconductor Wafer Grinding Equipments Import and Export
5.4 Europe Semiconductor Wafer Grinding Equipments Market Analysis
5.4.1 Europe Semiconductor Wafer Grinding Equipments Production
5.4.2 Europe Semiconductor Wafer Grinding Equipments Revenue
5.4.3 Key Manufacturers in Europe
5.4.4 Europe Semiconductor Wafer Grinding Equipments Import and Export
5.5 China Semiconductor Wafer Grinding Equipments Market Analysis
5.5.1 China Semiconductor Wafer Grinding Equipments Production
5.5.2 China Semiconductor Wafer Grinding Equipments Revenue
5.5.3 Key Manufacturers in China
5.5.4 China Semiconductor Wafer Grinding Equipments Import and Export
5.6 Japan Semiconductor Wafer Grinding Equipments Market Analysis
5.6.1 Japan Semiconductor Wafer Grinding Equipments Production
5.6.2 Japan Semiconductor Wafer Grinding Equipments Revenue
5.6.3 Key Manufacturers in Japan
5.6.4 Japan Semiconductor Wafer Grinding Equipments Import and Export
5.7 Southeast Asia Semiconductor Wafer Grinding Equipments Market Analysis
5.7.1 Southeast Asia Semiconductor Wafer Grinding Equipments Production
5.7.2 Southeast Asia Semiconductor Wafer Grinding Equipments Revenue
5.7.3 Key Manufacturers in Southeast Asia
5.7.4 Southeast Asia Semiconductor Wafer Grinding Equipments Import and Export
5.8 India Semiconductor Wafer Grinding Equipments Market Analysis
5.8.1 India Semiconductor Wafer Grinding Equipments Production
5.8.2 India Semiconductor Wafer Grinding Equipments Revenue
5.8.3 Key Manufacturers in India
5.8.4 India Semiconductor Wafer Grinding Equipments Import and Export
6 Semiconductor Wafer Grinding Equipments Segment Market Analysis (by Type)
6.1 Global Semiconductor Wafer Grinding Equipments Production by Type
6.2 Global Semiconductor Wafer Grinding Equipments Revenue by Type
6.3 Semiconductor Wafer Grinding Equipments Price by Type
7 Semiconductor Wafer Grinding Equipments Segment Market Analysis (by Application)
7.1 Global Semiconductor Wafer Grinding Equipments Consumption by Application
7.2 Global Semiconductor Wafer Grinding Equipments Consumption Market Share by Application (2014-2019)
8 Semiconductor Wafer Grinding Equipments Major Manufacturers Analysis
8.1 Applied Materials
8.1.1 Applied Materials Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.1.2 Applied Materials Product Introduction, Application and Specification
8.1.3 Applied Materials Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.1.4 Main Business and Markets Served
8.2 Ebara Corporation
8.2.1 Ebara Corporation Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.2.2 Ebara Corporation Product Introduction, Application and Specification
8.2.3 Ebara Corporation Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.2.4 Main Business and Markets Served
8.3 Lapmaster
8.3.1 Lapmaster Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.3.2 Lapmaster Product Introduction, Application and Specification
8.3.3 Lapmaster Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.3.4 Main Business and Markets Served
8.4 Logitech
8.4.1 Logitech Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.4.2 Logitech Product Introduction, Application and Specification
8.4.3 Logitech Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.4.4 Main Business and Markets Served
8.5 Entrepix
8.5.1 Entrepix Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.5.2 Entrepix Product Introduction, Application and Specification
8.5.3 Entrepix Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.5.4 Main Business and Markets Served
8.6 Revasum
8.6.1 Revasum Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.6.2 Revasum Product Introduction, Application and Specification
8.6.3 Revasum Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.6.4 Main Business and Markets Served
8.7 Tokyo Seimitsu
8.7.1 Tokyo Seimitsu Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.7.2 Tokyo Seimitsu Product Introduction, Application and Specification
8.7.3 Tokyo Seimitsu Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.7.4 Main Business and Markets Served
8.8 Logomatic
8.8.1 Logomatic Semiconductor Wafer Grinding Equipments Production Sites and Area Served
8.8.2 Logomatic Product Introduction, Application and Specification
8.8.3 Logomatic Semiconductor Wafer Grinding Equipments Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.8.4 Main Business and Markets Served
9 Development Trend of Analysis of Semiconductor Wafer Grinding Equipments Market
9.1 Global Semiconductor Wafer Grinding Equipments Market Trend Analysis
9.1.1 Global Semiconductor Wafer Grinding Equipments Market Size (Volume and Value) Forecast 2019-2025
9.2 Semiconductor Wafer Grinding Equipments Regional Market Trend
9.2.1 North America Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.2 Europe Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.3 China Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.4 Japan Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.5 Southeast Asia Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.2.6 India Semiconductor Wafer Grinding Equipments Forecast 2019-2025
9.3 Semiconductor Wafer Grinding Equipments Market Trend (Product Type)
9.4 Semiconductor Wafer Grinding Equipments Market Trend (Application)
10.1 Marketing Channel
10.1.1 Direct Marketing
10.1.2 Indirect Marketing
10.3 Semiconductor Wafer Grinding Equipments Customers
11 Market Dynamics
11.1 Market Trends
11.2 Opportunities
11.3 Market Drivers
11.4 Challenges
11.5 Influence Factors
12 Conclusion
13 Appendix
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Author List
13.4 Disclaimer
