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Electronics & Semiconductor

Global Embedded Subscriber Identity Module (e-SIM) Market Professional Survey Report 2019

A conventional SIM card is pre-provisioned with an administrator profile, while GSMA inserted SIMs are reprogrammable. e-SIMs could revolutionize the gadgets as it is the period of connected gadget and wearables. SIM cards have changed from a module equipment piece to a SIM that will be incorporated with gadgets at the time of manufacturing.

The global Embedded Subscriber Identity Module (e-SIM) market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Embedded Subscriber Identity Module (e-SIM) volume and value at global level, regional level and company level. From a global perspective, this report represents overall Embedded Subscriber Identity Module (e-SIM) market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Embedded Subscriber Identity Module (e-SIM) in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Embedded Subscriber Identity Module (e-SIM) manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Deutsche Telekom AG
Gemalto NV
Infineon Technologies
NXP Semiconductors
Sierra Wireless
STMicroelectronics
Vodafone
Giesecke & Devrient
Idemia
NTT DOCOMO

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
e-SIM Card
Chip

Segment by Application
Automotive
Consumer Electronics
Manufacturing
Telecommunication
Transportation & Logistics,
Others
Table of Contents

Executive Summary
1 Industry Overview of Embedded Subscriber Identity Module (e-SIM)
1.1 Definition of Embedded Subscriber Identity Module (e-SIM)
1.2 Embedded Subscriber Identity Module (e-SIM) Segment by Type
1.2.1 Global Embedded Subscriber Identity Module (e-SIM) Production Growth Rate Comparison by Types (2014-2025)
1.2.2 e-SIM Card
1.2.3 Chip
1.3 Embedded Subscriber Identity Module (e-SIM) Segment by Applications
1.3.1 Global Embedded Subscriber Identity Module (e-SIM) Consumption Comparison by Applications (2014-2025)
1.3.2 Automotive
1.3.3 Consumer Electronics
1.3.4 Manufacturing
1.3.5 Telecommunication
1.3.6 Transportation & Logistics,
1.3.7 Others
1.4 Global Embedded Subscriber Identity Module (e-SIM) Overall Market
1.4.1 Global Embedded Subscriber Identity Module (e-SIM) Revenue (2014-2025)
1.4.2 Global Embedded Subscriber Identity Module (e-SIM) Production (2014-2025)
1.4.3 North America Embedded Subscriber Identity Module (e-SIM) Status and Prospect (2014-2025)
1.4.4 Europe Embedded Subscriber Identity Module (e-SIM) Status and Prospect (2014-2025)
1.4.5 China Embedded Subscriber Identity Module (e-SIM) Status and Prospect (2014-2025)
1.4.6 Japan Embedded Subscriber Identity Module (e-SIM) Status and Prospect (2014-2025)
1.4.7 Southeast Asia Embedded Subscriber Identity Module (e-SIM) Status and Prospect (2014-2025)
1.4.8 India Embedded Subscriber Identity Module (e-SIM) Status and Prospect (2014-2025)

2 Manufacturing Cost Structure Analysis
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Embedded Subscriber Identity Module (e-SIM)
2.3 Manufacturing Process Analysis of Embedded Subscriber Identity Module (e-SIM)
2.4 Industry Chain Structure of Embedded Subscriber Identity Module (e-SIM)

3 Development and Manufacturing Plants Analysis of Embedded Subscriber Identity Module (e-SIM)
3.1 Capacity and Commercial Production Date
3.2 Global Embedded Subscriber Identity Module (e-SIM) Manufacturing Plants Distribution
3.3 Major Manufacturers Technology Source and Market Position of Embedded Subscriber Identity Module (e-SIM)
3.4 Recent Development and Expansion Plans

4 Key Figures of Major Manufacturers
4.1 Embedded Subscriber Identity Module (e-SIM) Production and Capacity Analysis
4.2 Embedded Subscriber Identity Module (e-SIM) Revenue Analysis
4.3 Embedded Subscriber Identity Module (e-SIM) Price Analysis
4.4 Market Concentration Degree

5 Embedded Subscriber Identity Module (e-SIM) Regional Market Analysis
5.1 Embedded Subscriber Identity Module (e-SIM) Production by Regions
5.1.1 Global Embedded Subscriber Identity Module (e-SIM) Production by Regions
5.1.2 Global Embedded Subscriber Identity Module (e-SIM) Revenue by Regions
5.2 Embedded Subscriber Identity Module (e-SIM) Consumption by Regions
5.3 North America Embedded Subscriber Identity Module (e-SIM) Market Analysis
5.3.1 North America Embedded Subscriber Identity Module (e-SIM) Production
5.3.2 North America Embedded Subscriber Identity Module (e-SIM) Revenue
5.3.3 Key Manufacturers in North America
5.3.4 North America Embedded Subscriber Identity Module (e-SIM) Import and Export
5.4 Europe Embedded Subscriber Identity Module (e-SIM) Market Analysis
5.4.1 Europe Embedded Subscriber Identity Module (e-SIM) Production
5.4.2 Europe Embedded Subscriber Identity Module (e-SIM) Revenue
5.4.3 Key Manufacturers in Europe
5.4.4 Europe Embedded Subscriber Identity Module (e-SIM) Import and Export
5.5 China Embedded Subscriber Identity Module (e-SIM) Market Analysis
5.5.1 China Embedded Subscriber Identity Module (e-SIM) Production
5.5.2 China Embedded Subscriber Identity Module (e-SIM) Revenue
5.5.3 Key Manufacturers in China
5.5.4 China Embedded Subscriber Identity Module (e-SIM) Import and Export
5.6 Japan Embedded Subscriber Identity Module (e-SIM) Market Analysis
5.6.1 Japan Embedded Subscriber Identity Module (e-SIM) Production
5.6.2 Japan Embedded Subscriber Identity Module (e-SIM) Revenue
5.6.3 Key Manufacturers in Japan
5.6.4 Japan Embedded Subscriber Identity Module (e-SIM) Import and Export
5.7 Southeast Asia Embedded Subscriber Identity Module (e-SIM) Market Analysis
5.7.1 Southeast Asia Embedded Subscriber Identity Module (e-SIM) Production
5.7.2 Southeast Asia Embedded Subscriber Identity Module (e-SIM) Revenue
5.7.3 Key Manufacturers in Southeast Asia
5.7.4 Southeast Asia Embedded Subscriber Identity Module (e-SIM) Import and Export
5.8 India Embedded Subscriber Identity Module (e-SIM) Market Analysis
5.8.1 India Embedded Subscriber Identity Module (e-SIM) Production
5.8.2 India Embedded Subscriber Identity Module (e-SIM) Revenue
5.8.3 Key Manufacturers in India
5.8.4 India Embedded Subscriber Identity Module (e-SIM) Import and Export

6 Embedded Subscriber Identity Module (e-SIM) Segment Market Analysis (by Type)
6.1 Global Embedded Subscriber Identity Module (e-SIM) Production by Type
6.2 Global Embedded Subscriber Identity Module (e-SIM) Revenue by Type
6.3 Embedded Subscriber Identity Module (e-SIM) Price by Type

7 Embedded Subscriber Identity Module (e-SIM) Segment Market Analysis (by Application)
7.1 Global Embedded Subscriber Identity Module (e-SIM) Consumption by Application
7.2 Global Embedded Subscriber Identity Module (e-SIM) Consumption Market Share by Application (2014-2019)

8 Embedded Subscriber Identity Module (e-SIM) Major Manufacturers Analysis
8.1 Deutsche Telekom AG
8.1.1 Deutsche Telekom AG Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.1.2 Deutsche Telekom AG Product Introduction, Application and Specification
8.1.3 Deutsche Telekom AG Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.1.4 Main Business and Markets Served
8.2 Gemalto NV
8.2.1 Gemalto NV Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.2.2 Gemalto NV Product Introduction, Application and Specification
8.2.3 Gemalto NV Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.2.4 Main Business and Markets Served
8.3 Infineon Technologies
8.3.1 Infineon Technologies Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.3.2 Infineon Technologies Product Introduction, Application and Specification
8.3.3 Infineon Technologies Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.3.4 Main Business and Markets Served
8.4 NXP Semiconductors
8.4.1 NXP Semiconductors Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.4.2 NXP Semiconductors Product Introduction, Application and Specification
8.4.3 NXP Semiconductors Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.4.4 Main Business and Markets Served
8.5 Sierra Wireless
8.5.1 Sierra Wireless Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.5.2 Sierra Wireless Product Introduction, Application and Specification
8.5.3 Sierra Wireless Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.5.4 Main Business and Markets Served
8.6 STMicroelectronics
8.6.1 STMicroelectronics Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.6.2 STMicroelectronics Product Introduction, Application and Specification
8.6.3 STMicroelectronics Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.6.4 Main Business and Markets Served
8.7 Vodafone
8.7.1 Vodafone Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.7.2 Vodafone Product Introduction, Application and Specification
8.7.3 Vodafone Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.7.4 Main Business and Markets Served
8.8 Giesecke & Devrient
8.8.1 Giesecke & Devrient Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.8.2 Giesecke & Devrient Product Introduction, Application and Specification
8.8.3 Giesecke & Devrient Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.8.4 Main Business and Markets Served
8.9 Idemia
8.9.1 Idemia Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.9.2 Idemia Product Introduction, Application and Specification
8.9.3 Idemia Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.9.4 Main Business and Markets Served
8.10 NTT DOCOMO
8.10.1 NTT DOCOMO Embedded Subscriber Identity Module (e-SIM) Production Sites and Area Served
8.10.2 NTT DOCOMO Product Introduction, Application and Specification
8.10.3 NTT DOCOMO Embedded Subscriber Identity Module (e-SIM) Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
8.10.4 Main Business and Markets Served

9 Development Trend of Analysis of Embedded Subscriber Identity Module (e-SIM) Market
9.1 Global Embedded Subscriber Identity Module (e-SIM) Market Trend Analysis
9.1.1 Global Embedded Subscriber Identity Module (e-SIM) Market Size (Volume and Value) Forecast 2019-2025
9.2 Embedded Subscriber Identity Module (e-SIM) Regional Market Trend
9.2.1 North America Embedded Subscriber Identity Module (e-SIM) Forecast 2019-2025
9.2.2 Europe Embedded Subscriber Identity Module (e-SIM) Forecast 2019-2025
9.2.3 China Embedded Subscriber Identity Module (e-SIM) Forecast 2019-2025
9.2.4 Japan Embedded Subscriber Identity Module (e-SIM) Forecast 2019-2025
9.2.5 Southeast Asia Embedded Subscriber Identity Module (e-SIM) Forecast 2019-2025
9.2.6 India Embedded Subscriber Identity Module (e-SIM) Forecast 2019-2025
9.3 Embedded Subscriber Identity Module (e-SIM) Market Trend (Product Type)
9.4 Embedded Subscriber Identity Module (e-SIM) Market Trend (Application)

10.1 Marketing Channel
10.1.1 Direct Marketing
10.1.2 Indirect Marketing
10.3 Embedded Subscriber Identity Module (e-SIM) Customers

11 Market Dynamics
11.1 Market Trends
11.2 Opportunities
11.3 Market Drivers
11.4 Challenges
11.5 Influence Factors

12 Conclusion
13 Appendix
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Author List
13.4 Disclaimer
  • FORMAT: PDF
  • PUBLISHED DATE: Sep, 2019
  • NO OF PAGES: 106